US12570520USUSPTO Grant XML

Cantilevered piezoelectric microelectromechanical systems microphone with stress compensation

A piezoelectric microelectromechanical systems (MEMS) microphone is provided comprising a substrate including walls defining a cavity and at least one of the walls defining an anchor region, a piezoelectric film layer supported by the substrate at the anchor region such that the piezoelectric film layer is cantilevered, the piezoelectric film layer being formed to introduce differential stress between a front surface of the piezoelectric film layer oriented away from the cavity and a back surface of the piezoelectric film layer oriented towards the cavity such that the piezoelectric film layer is bent into the cavity, and an electrode disposed over the piezoelectric film layer and adjacent the anchor region. A method of manufacturing such a MEMS microphone is also provided.

Patent

Brief

Patent brief

Problem

How can vibration in electric motors and rotors be reduced?

Novelty

method of manufacturing such a MEMS microphone is also provided.

Uses

Motor control, Precision machinery, Electromechanical systems

Assignee

SKYWORKS SOLUTIONS, INC.

Published

Mar 10, 2026

Inventors

You Qian, Rakesh Kumar, Guofeng Chen

Domain

Electromechanical systems

Plain-English summary

Problem

How can vibration in electric motors and rotors be reduced?

Solution

piezoelectric microelectromechanical systems (MEMS) microphone is provided comprising a substrate including walls defining a cavity and at least one of the walls defining an anchor region, a piezoelectric film layer supported by the substrate at the anchor region such that the piezoelectric film layer is cantilevered, the piezoelectric film layer being formed to introduce differential stress between a front surface of the piezoelectric film layer oriented away from the cavity and a back surface of the piezoelectric film layer oriented towards the cavity such that the piezoelectric film layer is bent into the cavity, and an electrode disposed over the piezoelectric film layer and adjacent the anchor region.

Key novelty

method of manufacturing such a MEMS microphone is also provided.

Applications

Motor controlPrecision machineryElectromechanical systems

Relevant search intents

compensation

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