A heat dissipation module of a projection device includes a heat generating component, a thermoelectric cooling chip, a heat insulating hollow body, a heating element and a control element. The thermoelectric cooling chip has opposite hot and cold ends. The cold end is connected to the heat generating component. The heat insulating hollow body has first and second openings communicating with each other. The thermoelectric cooling chip is disposed in and seals the first opening. The cold end is located in the heat insulating hollow body. The heat generating component is disposed in and seals the second opening. The heating element heats the heat insulating hollow body. The control component is electrically connected to the heating element and determines whether a temperature in the projection device reaches a dew point temperature and drives the heating element to heat the heat insulating hollow body accordingly. An anti-condensation method is also provided.
Patent
BriefPatent brief
Problem
How can heat, airflow, and thermal load be managed more effectively in compact systems?
Novelty
The thermoelectric cooling chip has opposite hot and cold ends.
Uses
Patent review
Assignee
Coretronic Corporation
Published
Mar 10, 2026
Inventors
Chenghan Lu, Chih-Sheng Wu
Domain
Thermal systems
Problem
How can heat, airflow, and thermal load be managed more effectively in compact systems?
Solution
heat dissipation module of a projection device includes a heat generating component, a thermoelectric cooling chip, a heat insulating hollow body, a heating element and a control element.
Key novelty
The thermoelectric cooling chip has opposite hot and cold ends.
Applications
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