US12571598USUSPTO Grant XML

Loop-type heat pipe

An evaporator includes a first metal layer having a first inner surface and a first outer surface, a second metal layer having a second inner surface bonded to the first inner surface and a second outer surface, and a porous body provided between the first outer surface and the second outer surface. The porous body includes first bottomed holes provided in the first inner surface, second bottomed holes provided in the second inner surface, a fine pore, a first groove portion provided in the first inner surface, and a second groove portion provided in the second inner surface. The first groove portion and the second groove portion are provided not to overlap each other in a plan view. The first outer surface and the second outer surface serve as an outer surface of the evaporator.

Patent

Brief

Patent brief

Problem

How can heat, airflow, and thermal load be managed more effectively in compact systems?

Novelty

The porous body includes first bottomed holes provided in the first inner surface, second bottomed holes provided in the...

Uses

Thermal management, High-density electronics, Cooling loops

Assignee

SHINKO ELECTRIC INDUSTRIES CO., LTD.

Published

Mar 10, 2026

Inventors

Yoshihiro Machida

Domain

Thermal systems

Plain-English summary

Problem

How can heat, airflow, and thermal load be managed more effectively in compact systems?

Solution

evaporator includes a first metal layer having a first inner surface and a first outer surface, a second metal layer having a second inner surface bonded to the first inner surface and a second outer surface, and a porous body provided between the first outer surface and the second outer surface.

Key novelty

The porous body includes first bottomed holes provided in the first inner surface, second bottomed holes provided in the second inner surface, a fine pore, a first groove portion provided in the first inner surface, and a second groove portion provided in the second inner surface.

Applications

Thermal managementHigh-density electronicsCooling loops

Relevant search intents

heat pipe

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