Phase-change cooling

Heat sink with flattened heat pipes

US12571597 • Furukawa Electric Co., Ltd.

heat sink includes a plurality of heat pipes to be thermally connected to a heating element, and a heat dissipation section thermally connected to the plurality of heat pipes, in which in the plurality of heat pipes, at least evaporation sections to be thermally connected to the heating element have flattened portions whose cross sectional shape in a direction orthogonal to a heat transfer direction of the plurality of heat pipes is flattened, and surfaces in the flattened portions in a thickness direction are arranged facing the heating element.

Gear box with lubrication channel

US12571467 • DANA (WUXI) TECHNOLOGY CO. LTD.

high speed gear box including ribs, gears with holes, and oil channels configured to divide and distribute lubricating oil and contacting the lubricating oil with a high speed gear box housing wall.

Thermally adaptive coatings for efficient heating and cooling applications

US12571948 • The Johns Hopkins University

composite and an adaptive coating are provided.

Desiccant enhanced evaporative cooling systems and methods

US12571549 • Nortek Air Solutions Canada, Inc.

Disclosed are systems and methods for conditioning air using a liquid-to-air membrane energy exchanger (LAMEE) as a pre-dryer, in combination with a direct evaporative cooler (DEC).

Thermoelectric generator for a turbine engine

US12571325 • General Electric Company

thermoelectric generator for a turbine engine is provided.

Vehicle fuel storage system including bladder

US12570141 • Plastic Omnium Advanced Innovation and Research

fuel storage system may be configured for a vehicle and may include a fuel tank, at least one inflatable bladder extending inside the tank, and at least one heat storage member, extending inside the tank, comprising a phase change material having a melting point in a range of from 18 to 40 C.

Loop-type heat pipe

US12571598 • SHINKO ELECTRIC INDUSTRIES CO., LTD.

evaporator includes a first metal layer having a first inner surface and a first outer surface, a second metal layer having a second inner surface bonded to the first inner surface and a second outer surface, and a porous body provided between the first outer surface and the second outer surface.

Phase change switch fabricated with front end of the line process

US12575338 • Infineon Technologies AG

method includes providing a semiconductor substrate comprising a main surface, forming a dielectric region on the main surface, forming a recess in the dielectric region, forming a strip of phase change material within the recess, forming a heating element that is thermally coupled to the strip of phase change material, forming an interconnection region over the main surface before or after forming the recess, the interconnection region including a metallization layer and a dielectric layer, electrically connecting the strip of phase change material to a connecting one of the metallization layers from the interconnection region, and completing formation of the interconnection region after electrically connecting the strip of phase change material, wherein completing formation of the interconnection region includes forming an outer one of the dielectric layers from the interconnection region that is disposed over the connecting one of the metallization layers and comprises a planar upper surface.

Air cooling, latent heat cooling, and power supply cooling

US12575054 • CISCO TECHNOLOGY, INC.

Presented herein are techniques to improve air cooling for higher power and power density power supply examples, including using latent heat of vaporization as a single-phase liquid-cooling-to-air closed-loop system.

Heat spreader with excess solder basin

US6191946 • THERMAL CORP [US]

The apparatus is a heat spreader for attachment to a device to be cooled, with heat pipes attached within holes in the heat spreader.